Taiwanese chipmaker MediaTek on Monday launched Dimensity 820 system-on-chip for upper mid-budget smartphones. The newly launched SoC succeeds the Dimensity 800 chipset that was launched at the Consumer Electronics Show (CES) 2020 and it sits between the Dimensity 1000 series and the Helio G90 series.
“Our Dimensity 1000 is already powering impressive flagship 5G devices in a number of markets. With the new Dimensity 820, we’re now making 5G much more accessible,” Yenchi Lee, Assistant General Manager of MediaTek’s Wireless Communications Business Unit said in a statement.
Coming to the specifications, Dimensity 820 comes with an octa-core processor with all four ARM Cortex A76 processors clocking at 2.6GHz processor and the remaining four ARM Cortex A55 processors clocking at 2GHz frequency.
On the graphics front, the Dimensity 820 packs the ARM Mali G57 GPU that delivers a resolution of 2520 x 1080 pixels. It also has HyperEngine 2.0, which coupled with the GPU, delivers enhanced gaming performance. The company says that the HyperEngine 2.0 can also adjust the SoC resources — CPU, GPU and memory — to optimise power and performance during gaming.
It also has MediaTek APU 3.0 for better AI-camera capabilities, and Imagiq 5.0 image signal processor that can support up to up to 80-megapixel camera sensors. Additionally, the newly launched SoC features support for multi-frame 4K HDR video.
The MediaTek Dimensity 820 SoC also supports 5G connectivity. It also supports dual SIM, dual standby (DSDS) 5G technology for access to the fastest speeds and Voice over New Radio (VoNR) services on both SIMs.
MediaTek hasn’t announced the smartphones that will be powered by its newly launched Dimensity 820 chipset. However, reports hint that Xiaomi Redmi Note 10 could be powered by the newly announced chipset. That said, neither Xiaomi nor MediaTek has said anything about the matter yet. So all we can do for now is sit tight and wait for the two companies to break the silence.